Thermal-Mechanical Design Engineer – Semiconductor Packaging

Applied Materials, Inc.

Singapore1080 - 1560📅 25/10/2026

Descripción

Applied Materials, Inc. in Singapore seeks a PhD-level mechanical engineering researcher to develop and refine finite element models for evaluating thermal and mechanical behavior of semiconductor packages. You will perform thermo‑mechanical reliability analyses, simulate stress and warpage in advanced packaging, and build robust thermal models while contributing to knowledge sharing and documentation. J-18808-Ljbffr

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