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2.5D / 3D Assembly Engineer

JAC Recruitment Singapore

Singapore1.080-1.680 SGD📅 1/11/2026

Descripción

2.5D / 3D Assembly Engineer About the role We are seeking a highly skilled 2.5D / 3D Assembly Engineer to support the development and implementation of advanced semiconductor packaging and integration technologies. This role will focus on wafer-level packaging, 2.5D/3D assembly processes, package design optimization, reliability engineering, and advanced technology development. The successful candidate will play a key role in driving innovation, improving assembly methodologies, collaborating w…
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