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Head of Device Fabrication, Advanced Packaging and Assembly

Universal Quantum

Singapore📅 30/9/2026

Descripción

At Universal Quantum, we are building the next generation of quantum computers - machines capable of solving problems once thought impossible. Our technology has the potential to transform industries from healthcare to aerospace, materials science, and beyond. As we scale from breakthrough R&D to global delivery, resilient execution becomes as critical as technical innovation. The Head of Device Fabrication, Advanced Packaging and Assembly is accountable for the development, industrialisation, …
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