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Packaging Research and Development Engineer

Intel Corporation

Phoenix, Maricopa County108790 - 108790📅 13/8/2026

Descripción

Job Details: Job Description: Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and material development to scale advanced substrate packaging technology to enable further die disaggregation / heterogenous integration. This position requires most of time spent on the factory floor and/or interacting with equipment/material suppliers. The candidate will…
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