Director of Chip-to-Package Reliability & Quality

Micron Technology, Inc. Singapore is seeking a Director of Package Quality & Reliability Engineering to lead the execution and continuous improvement of package reliability, qualification, and failure analysis across NPI and high-volume manufacturing. The role collaborates with PDE, front-end fabrication, manufacturing and quality teams to drive robust Design for Reliability and structured problem-solving at the chip-to-package interface. J-18808-Ljbffr