HBM & NPI Engineer — Memory Packaging Innovator

Micron Technology, Inc. in Singapore seeks an Engineer for High Bandwidth Memory (HBM) and New Product Introduction (NPI) to support next-generation memory packaging technologies. The role focuses on transitioning developments into high-volume manufacturing with cross-functional collaboration across Development, Manufacturing and supplier teams. You will apply AI-enabled tools, perform DOE-driven analysis, and contribute to technology transfer initiatives while aligning with Micron’s core value…