Advanced Packaging Metrology Engineer: Real-Time Defect Analysis

Micron Technology Singapore is seeking an Advanced Packaging Metrology‑RDA Engineer to develop metrology recipes for high‑performance memory packaging. You will optimize inspection methods, perform in‑line characterization, and analyze data with tools like Power BI to drive continuous improvement. A strong background in semiconductor processing and statistics is required, with AI‑enabled optimization encouraged. J-18808-Ljbffr