Principal Engineer – Advanced Packaging & AI Innovation

Micron Technology is seeking a highly qualified professional to advance assembly processes for state‑of‑the‑art packaging, including wafer‑level packaging and die stacking, to drive performance, cost efficiency, manufacturability, and reliability. You will deploy tools and collaborate across Packaging, Assembly, Front End Wafer Fab, and Quality teams in a fast‑paced environment. The role emphasizes AI literacy, data analytics, and cross‑functional coordination to deliver robust technology J-188…