Principal Engineer: AI Packaging Concepts & Innovation

Infineon Technologies AG in South Africa invites applications for a Principal Engineer Package Concept Engineering in our R&D team. You will shape future packaging concepts for AI computing modules, validate ideas with simulations and hardware demonstrators, and partner with backend teams and OSATs to push packaging development forward. You will occasionally travel to customers and suppliers and communicate fluently in German and English while contributing to decarbonization and digitalization …