Singapore-Based Advanced Packaging Engineer - 2.5D & DT

GlobalFoundries inc. in Singapore seeks an Advanced Packaging 2.5D and Deep Trench Integration Engineer to lead integration activities for 2.5D and deep trench technologies from early development to manufacturing readiness. You will work on silicon interposers, TSVs, redistribution layers, wafer thinning, and package-level integration, coordinating with engineering and manufacturing teams. You will plan experiments, analyze electrical and physical data, troubleshoot processes, and drive J-18808…