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Principal Engineer - Advanced Packaging

imec

Leuven📅 29/7/2026

Descripción

Principal Engineer – Advanced Packaging What you will do As a Principal Engineer you have obtained a broad, in-depth and hands-on knowledge of wafer bonding & advanced packaging processes in the semiconductor industry. Your main responsibilities will include: Using your expertise, you will support the team members during technical and engineering challenges. You will coach and develop the team to bring the processes we support toward a higher maturity level. Using your industry background, you …
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