Dry etch R&D Engineer Advanced Patterning

Dry etch R&D Engineer Advanced Patterning Background Pitch scaling is one of the fundamental driver for semiconductor device performance improvement. To print smaller feature size, Extreme Ultraviolet (EUV) lithography has been introduced. Additionally, multipatterning schemes are employed to reach critical dimensions beyond the lithographic resolution limit. To support this ongoing miniaturization, it is crucial to ensure the precise transfer of the photoresist into the underlying layers by pl…