MTS: Package & CPI Tech for Next-Gen Memory

Micron Technology, Inc. is seeking an accomplished technical leader to join our Package Development Engineering (PDE) organization as a Member of Technical Staff (MTS). You will define and drive chip-package interaction (CPI) technology strategy and roadmaps to enable advanced silicon node transitions in next-generation memory products. This is a high-impact, cross-functional leadership role that requires collaboration with global teams spanning Fab Process Integration, Product Development, J-1…