Senior Manager, Thermal Packaging & NPI Readiness

Advanced Micro Devices, Inc. (AMD) is seeking a senior leader to manage external manufacturing operations for backend engineering in Singapore. You will drive supplier engagement for thermal cooling solutions, oversee NPI readiness, and push for high-volume production execution while developing a geographically distributed engineering team. The role requires hands-on leadership, strong technical judgement, and excellent cross-functional collaboration to deliver results in a fast-paced J-18808-L…