Senior/Principal Metrology Engineer — Advanced Packaging (AI)

Micron Technology, Inc. in Singapore is seeking a Staff/Principal Engineer for Advanced Package Metrology-Real-Time Defect Analysis. You will develop metrology recipes, establish inspection methods, and drive AI-enabled insights across cross-functional teams to improve yield and reliability. Ideal candidates have PhD or Master’s with several years in semiconductor packaging, strong analytics (Python/R/SQL), and experience with metrology systems and data dashboards. J-18808-Ljbffr