IC Packaging Design Engineer

Role : IC Packaging Design Engineer LOC: Chandler, AZ or Hillsboro, OR (ONSITE) Experience : !0 years Skills Required : - Bachelor s or Master s degree in Electrical /Electronics Engineering Experience Tier: Senior-level (primary); Mid-level (secondary) Senior-Level: ~10 years in IC packaging / package design Mid-Level: 4-6 years (MS) or 6 years (BS) in IC packaging / package design Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package D…