Senior Thermo-Mechanical Simulation Lead in 2.5D/3D Packaging

National University of Singapore invites applications for a Senior Research Fellow in the ECE Department to drive thermo-mechanical modeling and advanced thermal simulations for next-generation semiconductor packaging, including 2.5D/3D, chiplet integration and silicon photonics. You will develop FE/Multiphysics tools, analyze package and system thermal performance, model stresses from CTE mismatch, and evaluate reliability under thermal and power cycling. J-18808-Ljbffr