Die Attach Engineer, Silicon Photonics Packaging

Lumilens in Singapore is seeking a Die Attach Manufacturing Engineer – Process & Equipment to lead die attach and equipment qualification for PIC packaging. You will drive sub-micron alignment, material selection, and process optimization for high optical coupling efficiency. You will collaborate with design, reliability, and operations, establishing DOE-based process windows, CAPA, and NPI support for photonic packages. This role offers exposure to cutting-edge photonics manufacturing. J-18808…