Senior Memory Packaging Pathfinding Architect

Micron Technology in Singapore seeks a Package Pathfinding Architect to shape next‑generation memory packaging and system architectures. You will drive end‑to‑end optimization across silicon, package, and board, interfacing with customers to craft scalable, high‑performance solutions for edge‑AI and datacenter memory. The role combines deep expertise in memory timing, signaling, PDN design, and AI-enabled design automation to push the boundaries of packaging technology. J-18808-Ljbffr