Senior Process Engineering Lead - Electroplating & Packaging

Applied Materials South East Asia

Singapore1800 - 2280📅 16/10/2026

Descripción

Applied Materials in Singapore is seeking a Manager, Process Engineering (Electroplating) to lead the development and optimization of electroplating processes for advanced semiconductor packaging. You will manage engineers and collaborate across global teams to deliver differentiated technology solutions. The ideal candidate has 8 years in semiconductor process engineering, strong copper plating expertise (wafer‑level packaging, RDL, TSVs), and proven leadership in R&D. J-18808-Ljbffr

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