Descripción
Postulation uniquement en ligne - merci de mentionner sous source (ORP) Kandou AI is redefining the economics of AI infrastructure. Our proprietary MIMO‑over‑copper technology powers a high‑performance, chiplet‑based AI memory fabric that delivers high bandwidth and ultra‑low latency at dramatically lower power. Our architecture represents a foundational shift in how next‑generation AI hardware is built. We are seeking a Technical Advisor / Principal Architect to work directly with the CTO on the conception, modeling, and development of breakthrough communication and interconnect technologies. This is a rare opportunity for an engineer who thrives at the intersection of theory, architecture, and silicon implementation — someone who wants to help shape the future of chip‑to‑chip, die‑to‑die, memory, and networking interconnects. Role Overview: You will partner closely with the CTO to explore, evaluate, and prototype next‑generation communication system architectures. This role spans research, modeling, algorithm development, system architecture, and early‑stage silicon feasibility. You will help translate theoretical concepts into implementable designs that can scale into real products. What You Will Do: Partner with the CTO to develop next-generation communication and interconnect architectures. Explore novel signaling, coding, equalization, and system-level techniques. Build models, simulations, and prototypes to validate architectural concepts. Evaluate performance, power, latency, area, and manufacturability tradeoffs. Translate research into silicon-ready architectures and intellectual property. Identify emerging technologies and opportunities for competitive differentiation. Provide technical leadership and guidance across research, architecture, and product teams Required Qualifications: Advanced degree in Electrical Engineering, Computer Engineering, Applied Mathematics, Physics, or related field. Strong background in digital communications and communication