Packaging Machine Design Engineer

If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In Create Account) If you already have a Candidate Account, please Sign-In before you apply. Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial …