3D NAND Process Integration Engineer - Innovation Leader

Micron Technology, Inc.

Singapore1.080-1.560 SGD📅 10/11/2026

Descripción

Micron Technology, Inc. in Singapore is seeking a NAND Module Process Integration Engineer to design, develop, and implement advanced integration schemes for next-generation 3D NAND products. You will focus on improving yield, quality, and cost efficiency while meeting tight timelines. You will lead cross-functional teams, refine CSPEC criteria, coordinate funding for experiments, and help transfer new technologies from R&D to manufacturing to ensure a successful ramp-up. J-18808-Ljbffr

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