Die-to-Wafer Process Engineer — R&D & NPI

STATS CHIPPAC MANAGEMENT PTE. LTD. is seeking a semiconductor process engineer to develop, optimize, and qualify Die-to-Wafer processes including Flip Chip and Underfill for advanced packaging applications. You will support process readiness, yield improvement, and NPI, and maintain MES data and process instructions for development builds. You will collaborate with NPI, Operations, Quality and Equipment teams to transfer technology, qualify processes, and ensure robust manufacturing readiness i…