Senior Research Fellow - 2.5D/3D Packaging & Hybrid Bonding

National University of Singapore

Singapore1440 - 2160📅 24/10/2026

Descripción

The National University of Singapore’s ECE Department is seeking a Senior Research Fellow to lead and contribute to wafer processing modules and advanced packaging programs. The role involves driving 2.5D/3D and heterogeneous integration initiatives, collaborating with tool vendors, academic researchers, and industrial partners to push the boundaries of packaging technology. The successful candidate will spearhead research on CoW/WoW bonding, Cu interconnect integration, and related process J-1…

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