Global Director of Package Quality & Reliability

Micron Technology, Inc. in Singapore seeks a Director of Package Quality & Reliability Engineering to lead qualification and failure analysis for new product introductions and high-volume manufacturing across mobile, automotive, data center, and AI/HPC. You will collaborate with Package Development Engineering, front-end fabrication, and manufacturing to drive design for reliability, rigorous qualification, risk mitigation, and scalable processes while building strong team capability and J-1880…