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NPI Program Lead - Wafer and Bump Fab

stats chippac pte. ltd.

Singapore1.680-2.400 SGD📅 25/10/2026

Descripción

stats chippac pte. ltd. seeks a seasoned NPI program lead to drive new product introductions in a wafer fab environment. You will guide a multi-level team, align engineering and operations, and ensure smooth technology transfers from R&D to manufacturing. The role emphasizes KPI tracking, timely NPI delivery, and risk-free ramp, with close collaboration with customers and internal teams to meet schedule and quality targets. J-18808-Ljbffr
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