Senior 2.5D/3D Packaging Engineer

JAC Recruitment Consultant is seeking a highly skilled 2.5D/3D Assembly Engineer to support development and implementation of advanced semiconductor packaging and integration technologies in Singapore. You will focus on wafer-level packaging and optimization of 2.5D/3D assembly processes. The role involves reliability engineering, DFM/DFT collaboration, and close work with partners to deliver next-generation packaging solutions for high-performance semiconductor applications. J-18808-Ljbffr