Global TPM: Thermal & Mechanical Hardware Programs Lead

Advanced Micro Devices, Inc. (AMD) in Singapore seeks an experienced program lead for thermal, mechanical and advanced board-assembly development from requirements to production ramp. You will connect package, board, cooling and chassis integration to support schedules and engage suppliers globally. You will drive integrated schedules, coordinate interfaces, and manage risks with engineering and manufacturing teams, delivering evidence-based decisions at each milestone while ensuring DOT/DP J-1…