Senior Engineer — Real-Time Metrology for Packaging

Micron Technology, Inc. in Singapore seeks a Senior Engineer in Advanced Package Metrology-Real-Time Defect Analysis to drive metrology recipe development, data analytics, and AI-enabled improvements for high-performance memory packaging. You will work with peers across Packaging, Front End, and Quality teams to deliver reliable, efficient production metrics and continuous improvement. You will apply expertise in metrology and data analytics, leveraging tools like Power BI and AI-assisted J-188…