Memory Systems Pathfinding Architect

Micron Technology, Inc. in Singapore is seeking a Package Pathfinding Architect to define next-generation memory packaging architectures, optimizing speed, bandwidth, power, and thermal performance across silicon, package, and system levels. You will collaborate with silicon, board, and system design teams and key customers to translate long-term packaging roadmaps into scalable products, including AI-enabled design automation and measurement tooling. J-18808-Ljbffr