Advanced 3D Packaging Integration Lead

Advanced 3D Packaging Integration Lead Advanced packaging is reshaping how complex semiconductor systems are designed and manufactured. At IC-Link by imec, you will lead the integration of technologies such as silicon interposers, fine-pitch microbumps, redistribution layers, through-silicon vias and advanced bonding technologies into a coherent platform for prototyping and manufacturing. You will work at the intersection of technology development, semiconductor manufacturing, design enablement…