Descripción
1 Principal Engineer R&D - Build-up Process In your role you will take a role in developing next-generation build-up technologies for advanced Glass Core Substrate applications. You will drive innovation across process development and integration, enabling future high-performance semiconductor packaging solutions. Working closely with internal and external partners, you will shape technology roadmaps, solve complex technical challenges, and contribute to the successful industrialization of cutting-edge substrate technologies. Your Responsibilities * Leading the development of build-up technologies for Glass Core Substrate applications * Developing and optimize process technologies including glass handling, temporary support systems, dielectric lamination, via formation, metallization, lithography, etching, and plating * Establishing process integration strategies to achieve target electrical performance, mechanical reliability, yield, and manufacturability * Defining technology roadmaps for build-up structures, fine-line interconnects, and next-generation Glass Core Substrate architectures * Developing handling concepts and process solutions to minimize glass damage, warpage, cracking, and process-induced defects throughout manufacturing * Driving resolution of technical challenges related to material interactions, dimensional stability, process variation, and reliability performance * Leading root cause analysis and implementation of corrective actions for process and reliability issues * Collaborating closely with material suppliers, equipment vendors, and cross-functional teams to accelerate technology development and qualifications * Providing technical leadership for development programs, intellectual property generation, and technology transfer activities Your Profile * Bachelor's or Master's degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electronics Engineering, or a related field * 10+ years of experience in substrate, PCB, semico