Senior RF Packaging Tech Lead — Wafer-to-Package Integration

QUALCOMM, Inc.

Singapore2.160-2.880 SGD📅 4/10/2026

Descripción

Qualcomm RF360 Singapore is seeking a senior technical specialist to own end-to-end packaging technology and product integration, including wafer pre-assembly, Cu pillar bumping, and die sort. You will drive development and integration of RF SiP packaging processes and lead technology transfer from development to high-volume manufacturing with global partners. The role requires 10 years in semiconductor packaging, strong cross‑functional leadership, and hands-on experience with wafer J-18808-Lj…

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