Trabajo de packaging en singapore

Senior NPI Program Lead - Advanced Packaging

Micron Technology, Inc. · Singapore

1440 - 2040

NPI Program Lead, Semiconductor Packaging

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD · Singapore

1080 - 1560

Technology Development Engineer – Hybrid Bonding & Advanced Packaging (Internship)

Applied Materials · Singapore

MTS - Advanced Packaging 2.5D and Deep Trench Integration Engineer

GlobalFoundries · Singapore

Advanced Packaging & Thermal Characterization Engineer

ADVANCED MICRO DEVICES PTE LTD · Singapore

1080 - 1680

Packaging Process Engineer – D2W Hybrid Bonding

Applied Materials, Inc. · Singapore

1080 - 1800

Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. · Singapore

1440 - 2160

Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. · Singapore

1440 - 2160

Packaging Equipment Engineer – Design, Maintenance & Optimization

Energizer · Singapore

960 - 1440

Material Handler/Packaging Specialist - Tools Shipping

KLA · Singapore

MTS - Advanced Packaging 2.5D and Deep Trench Integration Engineer

GlobalFoundries inc. · Singapore

1440 - 2160

Singapore-Based Advanced Packaging Engineer - 2.5D & DT

GlobalFoundries inc. · Singapore

1440 - 2280

Advanced Packaging Design Engineer - AI-Driven, 2.5D/3D

Advanced Micro Devices Pte Ltd · Singapore

1080 - 1440

Senior 2.5D/3D Packaging Engineer

JAC Recruitment Consultant · Singapore

1080 - 1680

Silicon Photonics Engineer — PIC Design, Process & Packaging

U3 INFOTECH PTE. LTD. · Singapore

1440 - 2160

Advanced Packaging Technology Development (APTD) Process Technical Specialist

Micron · Singapore

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Applied Materials · Singapore

Senior Staff: Advanced Packaging Pathfinding Lead

Applied Materials, Inc. · Singapore

2160 - 2880

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Applied Materials, Inc. · Singapore

2160 - 2880

Non-English Product Packaging (Paid Data Task, Remote, Contract)

Kled AI · Singapore

29120 - 37440

Senior/Principal Metrology Engineer — Advanced Packaging (AI)

Micron Technology, Inc. · Singapore

1800 - 2760

Wafer-Level Packaging Tech Engineer (APTD/CEM)

Micron Technology, Inc. · Singapore

1080 - 1560

Production Operator (Wooden Packaging, many OT, Basic up to $2000) - Kranji - WCDT

Wecruit · Kranji

$1800 - 2500 per month

BEOL Process & Power Packaging Lead

GlobalFoundries · Singapore

2160 - 3360

Senior Engineer — Real-Time Metrology for Packaging

Micron Technology, Inc. · Singapore

1440 - 2160

Production Manager (Secondary Packaging & Redressing Operations)

Zuellig Pharma · Singapore

1440 - 2160

Engineer, APTD CEM - Advanced Packaging Equipment Engineering Singapore, Singapore Posted 14 hours ago

Micron Technology, Inc. · Singapore

1200 - 1560

Staff/Principal, APTD CEM - Advanced Packaging Wafer Level Technology

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD · Singapore

1440 - 2280

Senior Advanced Packaging TD Integrator

Micron Technology, Inc. · Singapore

1680 - 2280

Director, PDE Advance Packaging

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD · Singapore

3000 - 6240

Senior Engineer, Metrology & AI-Driven Packaging

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. · Singapore

1440 - 2160

Staff Engineer, Advanced Semiconductor Packaging

K&S Careers · Singapore

1080 - 1800

Director, Advanced Packaging NPI: Strategy & Execution

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD · Singapore

3000 - 6240

Senior FEA Modeling Engineer - Semiconductor Packaging

Applied Materials South East Asia Pte Ltd · Singapore

1440 - 2160

Part-Time Lecturer for DV5002 Packaging Design (ADM)

Nanyang Technological University · Singapore

996 - 1488

Senior Systems Engineering Lead for Advanced Packaging

Applied Materials South East Asia Pte Ltd · Singapore

2160 - 3000

Lead FEA Modeling Engineer, Advanced Packaging

Applied Materials, Inc. · Singapore

1440 - 2160

Thermal-Mechanical Design Engineer – Semiconductor Packaging

Applied Materials, Inc. · Singapore

1080 - 1560

Engineer Packaging Test Engineering

GlobalFoundries · Singapore

Senior Project Manager, Advanced Packaging R&D

A*STAR - Agency for Science, Technology and Research · Singapore

1080 - 1560

Senior Research Fellow [Thermo-Mechanical Packaging Simulation]

National University of Singapore · Singapore

1440 - 2280

Senior Process Engineer, Packaging - Global Travel

Kulicke & Soffa · Singapore

1080 - 1560

Senior Research Fellow - 2.5D/3D Packaging & Hybrid Bonding

National University of Singapore · Singapore

1440 - 2160

Die Attach Engineer, Silicon Photonics Packaging

Lumilens · Singapore

1440 - 2160

C&Q Lead Warehouse and Packaging

Advanced Manufacturing Tech Solutions · Singapore

1320 - 2160

Senior Memory Packaging Pathfinding Architect

Micron Technology · Singapore

2160 - 2880

Senior Assembly Engineer, Photonics Packaging

POET Technologies · Singapore

1080 - 1800

Advanced Packaging Metrology Engineer: Real-Time Defect Analysis

Micron Technology · Singapore

1080 - 1560

Principal Engineer – Advanced Packaging & AI Innovation

Micron Technology · Singapore

1800 - 2400

HBM & NPI Engineer — Memory Packaging Innovator

Micron Technology, Inc. · Singapore

1080 - 1440