Packaging Process Engineer – D2W Hybrid Bonding

Applied Materials, Inc.

Singapore1.080-1.800 SGD📅 6/11/2026

Descripción

Applied Materials, Inc. is seeking a Process Engineer with a strong layout design background. You will own test-vehicle design for hybrid bonding development, create GDS layouts, and validate interconnect performance from mask to measured data. Collaborate with process, metrology, and integration teams to analyze bond quality, reliability, and interface defects, while supporting D2W and W2W bonding flows and deriving layout rules from process requirements. J-18808-Ljbffr

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