Descripción
--- base: / meta-keywords: meta-viewport: width=device-width, initial-scale=1.0 --- Process Engineer 100% ===================== **Besi Switzerland AG** (formerly Esec AG) is a company of the Dutch Besi Group and one of the world's leading developer of leading edge assembly equipment and processes for leadframe, substrate and wafer level packaging applications in Advanced Packaging for semiconductor industry, headquartered in Switzerland and with service centers in Europe, and the USA. ### **About the job** As a Process Engineer, you are in the center of our next\-generation semiconductor assembly solutions, and part of driving the end\-to\-end development and optimization of high\-precision Die Bonding systems. **Your area of impact** * System and process development * Working closely with cross‑functional teams to develop and expand existing “Die Bonder” machine modules and associated software in line with evolving customer needs * Deriving system and process specifications for interdisciplinary development teams in mechanics, electronics, software, and control engineering * Planning, conducting and interpretation of laboratory tests to identify suitable system parameters and sequences * Optimization of the overall system with a focus on accuracy, repeatability, and productivity * Development of new or extension of existing "Die Bonding" process technologies: * analysis, modelling, design and testing * Support of internal and external customers worldwide **Your profile** * Master’s or Bachelor’s degree in engineering or physical sciences (mechanical, electrical, mechatronics, microtechnology, physics, or materials science) from a university, ETH, or FH * Professional experience in an international environment * Profound knowledge of English is a must\-have, knowledge nice\-to\-have * We are looking for a motivated team player who can work flexible and effectively in a fast\-paced, dynamic and international environment and who can manage interfaces to multiple teams